Some experts predict that 2014 will be the golden age of LED development. However, this does not mean that the traditional production technology and LED products can meet the needs of the development of the gold. The future of LED is bound to move towards the direction of "high efficiency and low consumption of healthy and intelligent diversified lighting ". Want to conform to the trend of the times, really cater to the development of gold, LED change and innovation is essential. April 25, Shenzhen Nanshan District Science and Technology Innovation Bureau and the Shenzhen LED Industry Federation jointly organized by the Shenzhen Semiconductor Lighting Industry Joint Innovation Center and many other units co-sponsored "2014LED New Technology Summit Forum and LED New Product Progress Report "Kicked off in Shenzhen. More than 300 well-known industry experts, entrepreneurs and related industry experts gathered around the "change and innovation - the evolution of LED technology trends," the theme of an in-depth discussion. A number of invited guests focused on the analysis of the status of the domestic LED and core technologies, innovation and application, the challenges and future trends. Liu Guoxu: Packaging will not disappear LED lighting applications are experiencing the transition from cell phones, displays, TV backlights, car headlights, and professional lighting to general lighting, and in the near future smart lighting will be a nascent market for many reasons: 1) The introduction of ban on incandescent lamps in various countries in the world; (2) The demand for sustained energy conservation; (3) The demand for environmental protection and low carbon life; (4) The demand for only green building; (5) Introduced; (6) a variety of standards, such as Energy Star standards. LED package is the largest part of the cost of lighting, accounting for about 35% of the total cost. In the LED package products, packaging materials and manufacturing costs, including two parts, both of which have exceeded the price of the chip, a package of the largest part of the total cost of the component. Future commercial lighting, high-chord finger and backlight wide color gamut will become a hot spot for the new generation of LED applications, reducing the luminous efficiency gap between cold white and warm white LED is a technical problem. Overdrive and high current density of light sources, phosphor technology to achieve high-volume and linear IC-driven light engine module + high-pressure LED will become the industry trend. Future seven major trends in LED packaging: (1) flip-chip welding, which will make wafer-level phosphor coating more streamlined; (2) chip-scale packaging, this package technology will achieve the size of not more than 1.2 times the chip scale (3) integrated package light engine technology, with a simple structure, AC power drive, better reliability, eliminating or reducing the external PCB structure, saving more Space and has better thermal performance, relative to the switch mode design, with lower electromagnetic interference; (4) LED filament to achieve 360 ​​° full-cycle light, analog incandescent light bulbs; (5) to reduce the warm white and cool white (6) high color rendering and wide color gamut, for commercial photos, high color refers to the color looks vibrant, more vivid red, for TV and Monitor, a wide color gamut provides a rich color experience ; (7) Quantun Dots quantum dot wavelength converter, the quantum dot diameter of 3-7nm, to achieve full spectrum of all colors, by adjusting the alert particle size, the peak emission wavelength can be adjusted to +/- 1nm, reducing light scattering, high Bright efficiency of more than 90%; Many people are doubting the future package will not disappear, this can tell you clearly, no! First of all, LED package features include chip leads, chip mechanical protection to help chip cooling and light, color processing, These are functional requirements, unless the chip will not heat, do not need light, color processing, LED package will disappear, but this is impossible. However, although the LED package will not disappear, but great changes and innovations occur, the chip factory or light source / module plant may achieve direct docking, which will reduce costs, but also facing the SMT accuracy, backwash cleaning, pre- Sorting, testing, cooling and a series of challenges, in some applications may only be part of the vertical integration capabilities of the company is feasible. Packaging companies want to stand firm in the fierce competition, you need to continue to change and innovate in the new model, you can increase value-added, and downstream customer strategy with each other director and reduce system prices and so on.
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